Advanced Rigid Flexible Circuits Supplier
Brand Name	KingSong/Customized
Layer	4
Material	CCL, PI, PET, PEN, FR-4
Base Material	FR4 + Polyimide
Solder mask color	Green & yellow cover film
Silkscreen color	White
Final Thickness	Flex board: 0.002″ – 0.1″ (0.05-2.5mm) Flex-rigid board: 0.0024″ – 0.16″ (0.06-4.0mm)
Surface Treatment	Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
Surface Finishing	Immersion Gold
Test Way	100% E-Test
Standard	IPC-Class2
Min Trace	Inner: 0.5oz: 4/4mil Outer: 1/3oz-0.5oz: 4/4mil
Min Width /Clearance	1oz: 5/5mil   1oz: 5/5mil 2oz: 5/7mil   2oz: 5/7mil
Min Hole Ring	Inner: 0.5oz: 4mil   1oz: 5/5mil   2oz: 5/7mil Outer: 1/3oz-0.5oz: 4mil   1oz: 5/5mil   2oz: 5/7mil
Copper Thickness	1oz
Board Thickness	1.6mm
Max / Min Insulation Thickness	2mil/0.5mil (50μm/12.7μm)
Min Hole Size and Tolerance	Min hole: 8mil Tolerance: PTH±3mil, NPTH±2mil
Min Slot	24mil x 35mil (0.6×0.9mm)
Solder Mask Alignment Tolerance	±3mil
Silkscreen Alignment Tolerance	±6mil
Silkscreen Line Width	5mil
Gold Plating	Nickel: 100μ” – 200μ” Gold: 1μ”-5μ”
Immersion Nickel / Gold	Nickel: 100μ” – 200μ” Gold: 1μ”-5μ”
OSP	Film: 8μ” – 20μ”
Test Voltage	Testing Fixture: 50-300V
Profile Tolerance of Punch	Accurate mould: ±2mil Ordinary mould: ±4mil Knife mould: ±8mil Hand-Cut: ±15mil

Delivery time:

Flexible PCB: 5-7 working days,
Rigid-flex PCB: 8-15 working days.

Package:

The inner vacuum packing, Outer standard carton box packing.

Shipping:

1. By DHL, UPS, FedEx, TNT, etc.
2. By sea for mass quantity according to the customer’s requirement.

If you need a quotation for your PCB projects, please provide the following info:

1. Quote, quantity.
2. Gerber file in a 274-x format.
3. Technical requirement or parameters (material, layer, copper thickness, board thickness, surface finishing, solder mask/silkscreen color…).

Classification of advanced rigid flexible circuit suppliers:

If classified according to the process, it can be divided into two types of rigid and flexible composite PCB boards and rigid-flexible circuit boards. The difference between hard and soft composite board technology can be achieved during processing, rigid PCB boards, and high-grade rigid-flexible PCBs. Common blind hole and buried hole design, thus enabling higher density PCB circuit design, as well as soft board and hardboard technology. Soft board and hardboard are separately produced before pressure synthesis of a single board, signal connection but no pass Hole design. However, the current “Rigid-Flex PCB Suppliers” are collectively referred to as all hard and soft board products, rather than subdividing them.