What is Solder Paste?
Solder paste is a kind of gray paste, a new soldering material applied to PCB SMT assembly, which helps to fix electronic components on PCB boards, making electrical connections and mechanical bonds between PCB pads and surface mount devices.
Solder paste is mainly composed of flux and solder powder (Flux & Solder Powder)
The role of flux
- Removes oxides from metal surfaces
- Protects the components to be soldered
- Holds the device in the proper position
What are the factors that affect the function of the solder paste?
- Uniformity of solder paste particles
- Percentage of solder powder in the flux
- Viscosity of the solder paste
- Thixotropic index and metal content of the solder paste
- Reflow process
What are the types of solder paste?
According to the flux type, solder can be divided into rosin-based solder paste, no-clean solder paste, water-soluble flux solder paste.
Solder paste in PCB SMT assembly
Reflow Soldering
For reflow soldering in PCB SMT assembly
Create solder joints
Solder paste as a homogeneous mixture of solder alloy and flux, solder paste helps to create reliable solder joints.
Leaded Components
Solder paste helps increase component density and reduce PCB manufacturing costs when assembled with leaded components
Stencil Printing
It helps in adding components to PCBs in established patterns
Jet Printing
Jet printing solder pastes are made from different formulations and therefore the solder paste has a higher fluidity.
Points to note when using solder paste
Make sure the stencil is accurate
Poorly printed stencils can hinder the application of solder paste.
Make sure the screen printer is programmed correctly
Accurate measurement and calibration of the solder paste screen printing equipment is key.
The right amount of solder paste
Excessive amounts and small amounts can lead to errors.
Correct process
You can choose between metal screen printing and mesh screen printing.
Safe handling
Solder paste contains organic solvents. When handling, try to avoid inhaling the fumes released by the solvents during operation, and avoid contact with skin and mucous membrane tissues for too long.
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