Through-Hole Assembly

The Assembly for the components, not only have SMT Assembly but also have Through-Hole Assembly, the components which by the through-hole assembly, all most of them have pin feet, so you can be called Through-hole component, Plug-in component or DIP component.

With the rapid development of SMT Assembly technology,SMT Assembly gradually replaces the Through-hole Assembly (DIP Assembly), however, due to the large size of some electronic components in PCBA production,so it is still needed DIP Assembly processing.

Through-hole Assembly processing can be generally divided into:
Pre-process components–plug-in—wave soldering—component cutting foot—repair welding (after welding)—washing board—testing

Pre-process components: the worker will go the component departments to get the components according to the BOM list, and check the correct model number and specification, according to the requirement for pre-process, use automatic bulk capacitor cutting machine, automatic transistor molding machine, automatic belt molding machine, and other molding equipment for processing.

Plug-in:insert the components to the corresponding position on the PCB board.

Wave soldering: put the plug-in PCB board on the wave soldering conveyor belt, and the soldering of the PCB board is completed through the processes of spraying flux, preheating, wave soldering, cooling, etc.

Component cutting foot:cut the feet of the welded PCBA board to reach the appropriate size.

Repair welding (after welding):to repair if any unwelded PCBA board.

Washing board:to wash the residues such as flux.

Testing:to ensure the quality of the PCBA.

Notes for DIP plug-in assembly processing:

1. The outside should be flat and the side with the writing must face up.
2. After the plug-in, the soldering pin does not block the pad.
3. For electronic components marked with direction, the direction must be uniform.
4. Keep the surface of electronic components clean.
5. For some sensitive components, the plug-in should not be too hard.
6. Note the height of components and pin spacing.